Edge Grinding Wheels for Silicon
Product Description :
* Processing Method｜Grinding
* Applications｜Semiconductor Material Processing
* Silicon wafer edge grinding wheels require strict shape precision and wear resistance, and require stable grinding capabilities, so metal bond grinding wheels can be used. We can provide single groove or multi groove, integrated coarse and fine grinding wheel according to customer’s requirements.
* Processing Material | Silicon Crystal
* Applications｜Semiconductor Material Processing
* Silicon wafer edge grinding wheels require strict shape precision and wear resistance, and require stable grinding capabilities, so metal bond grinding wheels can be used. We can provide single groove or multi groove, integrated coarse and fine grinding wheel according to customer’s requirements.
* Processing Material | Silicon Crystal
Catalog :
TAIWAN ASAHI DIAMOND INDUSTRIAL CO., LTD.
Brand Name：
Taiwan Asahi Diamond
Booth Number :
M0614
Contact Information :
- taiwandiamond.com
- +886-3-3636971
- +886-3-3620709
- 248 Hwa-Kong St., Pa-Deh Dist., Tao Yuan 334, Taiwan
