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CHIEN CHENS MACHINERY CO., LTD.
Product Description :
Specification
Table size: 1850 x 650 mm
Longitudinal travel: 1500 mm
Cross travel: 800 mm
Y slide way width: 1000 mm
Z Slide high: MAX 800 mm
Z Slide way width: 500 mm
Spindle taper: NT#50(BT)
Spindle motor: 7.5HP / 4P
Spindle speed: 40~3000 RPM
Feeding speed: 10~6000 mm/min
Ballscrew: Ø40 mm P=8 C3
Net weight: 5500 kgs
BUFFALO MACHINERY CO., LTD.
Product Description :
The DC12 is the most robust VMC in AXILE’s arsenal, perfectly suited for handling larger, lengthy workpieces. With a maximum table loading weight of 2.5 tonnes and maximum diameter of 2,200 mm X 1,200 mm, the DC12 takes on the larger, heavier parts common in the aerospace, power generation, and die and mold industries. Its double-column bridge construction allows for greater rigidity, as well as greater control over thermal deformation. As a result, the D12 is capable of deep cuts and complex contouring while maintaining utmost precision.
With larger workpieces come more chips, meaning the DC12 features excellent chip removal efficiency, to prolong tool life and ensure no residual interference. Therefore, the DC12 delivers the high surface quality expected by leading manufacturers.
BUFFALO MACHINERY CO., LTD.
Product Description :
The AXILE G8’s powerful gantry design perfectly balances rigidity and precision, ideal for the machining of complex workpieces.
With a maximum loading capacity up to 1,300 kg on a swiveling, rotary table, complemented by high-performance built-in spindles, the G8's agility enables production of a wide range of large parts and tools.
The G8 MT option offers both milling and turning in one machine, greatly increasing operational flexibility. By reducing set-up times and potential clamping errors, the G8 MT can efficiently machine a wider variety of parts, including cylindrical components.
FALCON MACHINE TOOLS CO., LTD.
Product Description :
Easy Setup, Flexible and Sealed for Grinding
The FVGC Series of vertical grinding machines is another prime example of Chevalier's position as the global leader in grinding technology. The series seamlessly increases efficiency and productivity for such industries as semiconductor, punch and aerospace, as well as other sectors for which these machines can be equipped. Workpieces in these fields primarily are a composite, single crystal silicon or brittle, along with other materials that present process challenges.
