展示テーマ
デジタルトランスフォーメーション
グリーントランスフォーメーション
Taiwan TeamA Tech. Co., Ltd.
製品の説明 :
擺脫時間、地點的限制，利用自動化生產解決方案再創生產率新高！無需人工操作，24小時不停機生產，製造大量、高質量物件，使用 Formlabs 自動化解決方案（包含 Form Auto、群機管理和高容量樹脂系統），在 3D 列印工作流程中更高效的工作並重新定義生產能力。在不增加列印機管理複雜性的情況下擴展您的零件生產。從任何地方點擊發送，Formlabs 自動化解決方案將處理剩下的工作流程。
【最大程度地降低每個零件的成本，節省高達 80% 的勞動力】
在 Form Auto 出現之前，每個完成的零件都需要在後處理之前從成型平台上手動移除。Form Auto 透過將 Formlabs 獲得專利的「快速剝離技術」與「成型平台 V2 」結合使用，完全自動化地移除零件。蒐集的零件被放置在防紫外線的容器中，無縫批量轉移到 Form Wash。
【24 小時不間斷 3D 列印，無需額外程序】
Form Auto 自動化生產系統旨在不閒置列印機、不讓列印物件在序列中等待，無論現場是否有操作人雃，Form Auto 始終準備好開始下一次列印。 隨時隨地構建多列印機群，從辦公室點擊「列印」，立即在生產間開始生產。透過群機管理中的圖像和影片遠程監控和審查成品零件，設備內相機在完成時捕獲每個列印件來保存每個部分的記錄。
MING YANG MACHINERY CO., LTD.
製品の説明 :
The model MTY 51/65 is equipped with a dual spindle double turret and double Y axes. The machine is combined with FANUC 31i PLUS for simultaneous control on triple tool systems. The machining support two turrets for one spindle and one turret for two spindles at the same time. In other words, each process will collaborate with three tools. Mostly, the machine improves 50% efficiency.
MONGTEC PRECISION INC.
製品の説明 :
BODY
Re-designed main body to improve rigidity and reduce vibration. Specially treated corrosion resistant steel body.
Bearings
Angular contact preloaded ball bearings of precision class P4 / ABEC 9.
Bevel Gears
Gleason computer based calculations for the Gleason cut spiral bevel drive gears with ground teeth in order to guarantee a bigger torque.
Torque and Speed
With Speeder 1：4：32,000 Rpm
(Standard 1：1：6000~12000Rpm)
Max Torque：160Nm
Internal Coolant
Max Pressure：70-100 bar
HIWIN TECHNOLOGIES CORPORATION
製品の説明 :
The key components in Wafer Robot, such as ballscrew and direct drive motor, are manufactured by HIWIN, with Hiwin-developed software, HIWIN has the advantages of vertical integration of hardware and software. HIWIN Wafer Robot integrates the high-precision, high-rigidity direct drive motor with repeatability of ±0.1mm, small rotating radius and high space utilization. HIWIN can provide customized service according to production requirements and enhance customer competitiveness. Applicable to the semiconductor industry (wafer pick and place), optoelectronic industry (small panel, small solar panels), LED industry (sapphire substrate, rubber ring) and other pick and place equipment.
