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デジタルトランスフォーメーション
グリーントランスフォーメーション
TAIWAN ASAHI DIAMOND INDUSTRIAL CO., LTD.
製品の説明 :
* Processing Method｜Grinding
* Applications｜Semiconductor Material Processing
* Silicon wafer edge grinding wheels require strict shape precision and wear resistance, and require stable grinding capabilities, so metal bond grinding wheels can be used. We can provide single groove or multi groove, integrated coarse and fine grinding wheel according to customer’s requirements.
* Processing Material | Silicon Crystal
HEIDENHAIN CO., LTD. (TAIWAN)
製品の説明 :
Collision protection is a major topic at HEIDENHAIN. The touch probes feature a large deflection path and offer additional safety with rated breaking points in the stylus or the connecting pin to the probe contact.
The TS 460 and TT 460 touch probes feature intelligent battery management in order to minimize current consumption. The touch probe switches in steps to the stand by condition: The longer a touch probe has been switched off, the less current it consumes. Activating a touch probe from a low standby level takes only a split second longer. This ensures high, application oriented availability.
