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TAIWAN MACHINE TOOL CO., LTD.
製品の説明 :
Strong casting and the perfect boxway stucture provides excellent cutting capacity for TTB-20MW Series. Sub-spinfle with milling function and Y-axis can satisfy customers' miltiple needs.
-The one cast base incorporates FEM analysis to achieve its optimal ribbing and structure to further enhance machine rigidity and stability.
-The 30 degree slant bed design has low center of gravity for easier swarf management and better erogonomic design. The TTB-20MW Series also offer optional rear type chip conveyor.
-To make sure the usage life of Y-axis ballscrew will get longer, there are three bearing on Y-axis ballscrew to enhance the support for pressure from top.
-The TTB-20MW Series can achieve maximum 20m/min for X axis and 25m/min for X axis. And the servo motors adopt absolute encoders for faster and more reliable positioning.
FONGEI INDUSTRY CO., LTD.
製品の説明 :
-It can process various chips created by complex machining.
-Equipped with a filter system for processing cutting fluid with 0.5mm filtrating accuracy.The roller filter screen features a self-cleaning function to ensure the dependability of filtration.
-Equipped with an industry-leading overload protection device the extends the parts service life of the chip conveyor.
VICTOR TAICHUNG MACHINERY WORKS CO., LTD.
製品の説明 :
．One piece 30˚ slant bed with large swing diameter
．10" Power chuck / 3500 rpm (A260)
． Z-axis travel 750 mm
．High thrust force by small pitch ballscrew
．High rapid feed 24 m/min (Z-axis)
．Shortened belt driven spindle
．Digital tailstock
．8” chuck for subspindle (opt.)
MING YANG MACHINERY CO., LTD.
製品の説明 :
The model MTY 51/65 is equipped with a dual spindle double turret and double Y axes. The machine is combined with FANUC 31i PLUS for simultaneous control on triple tool systems. The machining support two turrets for one spindle and one turret for two spindles at the same time. In other words, each process will collaborate with three tools. Mostly, the machine improves 50% efficiency.
TAIWAN ASAHI DIAMOND INDUSTRIAL CO., LTD.
製品の説明 :
* Processing Method｜Grinding
* Applications｜Semiconductor Material Processing
* Silicon wafer edge grinding wheels require strict shape precision and wear resistance, and require stable grinding capabilities, so metal bond grinding wheels can be used. We can provide single groove or multi groove, integrated coarse and fine grinding wheel according to customer’s requirements.
* Processing Material | Silicon Crystal
MING YANG MACHINERY CO., LTD.
製品の説明 :
This multi-tasking turning center is an advanced machine designed for precision complex parts processed in one setup.
Power & Versatility: It has Double Spindles and Turrets with back machining provided by an 8-station sub-turret and sub-spindle with a total tool capacity of up to 32 tools. This solution is a powerful combination of power, precision and versatility.
Front Machining: BMT45 12-Stations, Up to 24 tools, 7.5/11 kW Spindle Power, 55 mm Through Hole.
Back Machining: VDI 25 8-Stations Sub-Turret, 3.7/5.5 kW Spindle Power, 48 mm Through Hole.
