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TAIWAN ASAHI DIAMOND INDUSTRIAL CO., LTD.
製品の説明 :
* Processing Method｜Grinding
* Applications｜Semiconductor Material Processing
* Silicon wafer edge grinding wheels require strict shape precision and wear resistance, and require stable grinding capabilities, so metal bond grinding wheels can be used. We can provide single groove or multi groove, integrated coarse and fine grinding wheel according to customer’s requirements.
* Processing Material | Silicon Crystal
JARNG YEONG ENTERPRISE CO., LTD.
製品の説明 :
1. High rigidity body structure, machine base casting is integrally formed and high rigidity linear guide way, providing stabler, faster and higher precision.
2. Built-in main spindle is with C-axis function, high speed, big power, high precision and low vibration which can make surface of workpiece smoother.
3. Optional：Synchronous rotary guide bushing device, it's suitable for processing long workpiece which can reduce cycle processing time and improve production efficiency.
4. Sub-spindle is with C-axis function, it can work with live tooling for end side drilling, tapping and milling.
5. It can depend on different demand of machining to with or without Synchronous rotary guide bushing device.
6. Axes：Z1/X1/Y/C1/Z2/X2/C2 + 3 sets of live tooling devices (A/B1/B2)
7. Max. 23 tools, can do machining on front side and back side at the same time which can save time for processing.
8. With guide bush type travel is 180mm, min. offal is 150mm. Without guide bush type travel is 310mm, min. offal is 50mm.
YIDA PRECISION MACHINERY CO., LTD.
製品の説明 :
The MT-900 has a 5-axis milling head, two turrets, a tool magazine and twin spindles.
The design layout allows for maintaining a large work envelope for both lathe operations-turning and milling.
All six sides of a part can be machined without an operator having to manually resettle the workpiece, so nearly any parts can be machined in an automated manner.
